Cautions on handling semiconductor devices can be found in 5.6 Cautions on use environment and 5.14 Cautions on Packing, Storage, Shipment and Handling in the Review of Quality and Reliability Handbook. Please refer to this document.
• Do not store semiconductor devices in an environment where the storage temperature exceeds the rating.
Exceeding the absolute maximum ratings may cause quality degradation or irreparable damage to the device.
• Do not subject semiconductor devices to static electricity.
Exceeding the absolute maximum ratings (of the power supply voltage or input voltage) may cause quality degradation or irreparable damage to the device.
Refer to Chapter 6 in the Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)for details on how to protect against static electricity.
• When solder-mounting a semiconductor device on a board, do not exceed the recommended conditions (temperature, time, number of times of mounting).
Exceeding the absolute maximum ratings (maximum channel or junction temperature) may cause quality degradation or irreparable damage to the device.
If semiconductor devices with baking conditions that depend on the number of days the device can be stored after the dry pack has been opened has been stored for more than this number of days, the device must be prebaked for the requisite time before mounting.
• Do not connect or remove interface cables between devices while power is being supplied.
If interface cables are connected or removed while power is being supplied, the spike noise generated when a cable is connected or removed may make the voltage exceed the DC characteristics, causing quality degradation or irreparable damage to both the input and output sides.
It is important to take into account tool connection when developing your system using microcontrollers or devices in the market.
Note, however, that if the interface supports hot plug-in, connecting and removing cables while the power is being supplied will not cause a problem, as long as the specified procedure is followed.