The materials are classified as follows by pin processing.
External solder plating: Sn-Bi (tin-bismuth) or Sn (tin), Ni-Pd-Au (nickel-palladium-gold) (differs depending on the product)
External solder dip (Note): Sn-Ag-Cu (tin-sliver-copper)
Solder ball: Sn-Ag-Cu (tin-sliver-copper)
THD (Through Hole Device) type of discrete product (however, Sn-Bi for TO-251 (MP-3))
The other package materials are the same as lead solder products.