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What is the junction-case thermal resistance of SC-59 and SC-62?

Latest Updated:07/01/2008

Question:

What is the junction-case thermal resistance of the SC-59 (minimold) and SC-62 (power minimold) packages?

Answer:

The junction-case thermal resistance of neither package is specified (there is no specification for the total dissipation at Tc = 25°C).
Please use the following "Total Power Dissipation vs. Ambient Temperature" characteristics graph, which is included in the products' data sheets, to determine whether the product can be used in your application.

 The Total Power Dissipation vs. Ambient Temperature (TA) characteristics graph when mounting the SC-62 on a glass epoxy board.

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